Apparatus and method for slicing an ingot
AssigneeSiltron Inc.
InventorsEunsang Ji, Kyungmoo Lee
Life of this patent
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Abstract
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.
Claims6
A method for slicing an ingot into a plurality of wafers via a slurry while the slurry is supplied to a moving wire, the method comprising:
- slicing a first guide beam attached to one side of the ingot, with a wire;
- slicing the ingot;
- and
- slicing a second guide beam attached to an other side opposite to the one side of the ingot.
An apparatus for slicing an ingot, comprising:
- first and second work rollers arranged in parallel to each other;
- a wire continuously wound around the first and second work rollers with a predetermined pitch along a longitudinal direction thereof;
- a slurry supplier for supplying slurry to the wire arranged at one or both sides of the ingot;
- and
- a work plate for feeding an ingot to be sliced onto the wire between the first and second work rollers,
- wherein a first guide beam is adapted to be provided on one side of the ingot by the wire, and the second guide beam is adapted to be provided on an other side of the ingot by the work plate.
Dependencies are inferred from the claim text.