Polishing pad and forming method
AssigneeSony Corporation
InventorShunichi Shibuki
Life of this patent
Estimating the term…
Abstract
A polishing pad which ensures that a work can be easily removed from the polishing pad surface after polishing, the amount of a polishing liquid used for polishing can be reduced, and the production cost of the polishing pad can be lowered. A first polishing pad (1) for polishing a work is provided with a plurality of slots (11) piercing the first polishing pad (1) in a sa direction, the length in the longitudinal direction of the slots (11) being preferably not less than 20 mm, the pitch in the width direction of the slots (11) being preferably less than 100 mm, and small holes (not shown) may be provided in addition to the slots (11).
Claims6
1-18. (canceled)
A method of forming a polishing pad for polishing a surface of a material to be polished, comprising:
- providing a polishing pad;
- and
- forming slots in the polishing pad which extend through the entire thickness of said polishing pad in the thickness direction such that the slot opening on one surface of the pad is substantially the same size and shape as the slot opening on the opposing surface of the pad, and wherein the slots do not extend to an outer circumferential surface of the pad.
A method of forming a polishing pad for polishing a surface of a material to be polished, comprising:
- providing a polishing pad;
- and
- forming holes in the polishing pad which extend through the entire thickness of said polishing pad in the thickness direction, part of said plurality of holes being composed of slots and wherein the slots do not extend to an outer circumferential surface of the pad, and wherein each slot opening on one surface of the pad is substantially the same size and shape as the slot opening on the opposing surface of the pad.
Dependencies are inferred from the claim text.