Apparatus and method for slicing an ingot
AssigneeSiltron Inc.
InventorsEunsang Ji, Kyungmoo Lee
Life of this patent
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Abstract
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.
Claims2
A method for slicing an ingot into a plurality of wafers via slurry while the slurry is supplied to a moving wire, the method comprising:
- raising a feed speed of the ingot in a stepwise manner to a raised speed that is less than or equal to a maximum speed (Vmax);
- controlling the feed speed in accordance with a diameter variance of the ingot;
- and
- maintaining the feed speed at the raised speed.
Dependencies are inferred from the claim text.