Wired circuit board and production method thereof
AssigneeNitto Denko Corporation
InventorsKazushi Ichikawa, Yuichi Takayoshi
Life of this patent
Estimating the term…
Abstract
A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.
Claims6
A wired circuit board comprising:
- an insulating base layer;
- a conductive pattern formed on the insulating base layer;
- and
- an insulating cover layer formed on the insulating base layer for covering the conductive pattern,
- wherein the conductive pattern includes terminal portions for connecting with external terminals;
- the insulating cover layer has an opening formed correspondingly for the respective terminal portions;
- and
- a position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.
A production method of a wired circuit board, comprising the steps of:
- forming a conductive pattern including terminal portions for connecting with external terminals on an insulating base layer;
- forming an insulating cover layer on the insulating base layer to cover the conductive pattern so that an insulating cover layer is formed with an opening from which the terminal portions are exposed;
- forming a position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position;
- and
- determining whether or not the margin of the insulating cover layer is located in a proper position,
- wherein in the step of determining whether or not the margin of the insulating cover layer is located in a proper position, when the margin of the insulating cover layer is within the position determining zone, the wired circuit board is determined to be non-defective, while when the margin of the insulating cover layer is out of the position determining zone, the wired circuit board is determined to be defective.
Dependencies are inferred from the claim text.