Low profile compliant leads

A connector system for resiliently attaching and electrically connecting a first set of contacts substantially located on a first surface of a circuit chip to a second set of contacts substantially located on a second surface of a circuit board, the connector system comprising:

• a plurality of leads in predetermined spaced relation, each of the plurality of leads being sized and arranged to form a C-shaped body having a first leg and a second leg, the first leg and second leg being substantially parallel with a curved portion between the first leg and the second leg;
• each of the plurality of leads including a strip of mesh folded to form the C-shaped body with the first leg configured to connect to at least one of the first set of contacts and the second leg configured to connect to at least one of the second set of contacts, the plurality of leads being sized and arranged such that the first surface of the circuit chip is substantially parallel to the second surface of a circuit board;
• and
• wherein the plurality of leads defines a separation of about 0.016 inches or less between the first surface of the circuit chip and second surface of the circuit board.

A method of electrically and mechanically connecting a circuit chip to a circuit board, the circuit chip having a plurality of first contacts and the circuit board having a plurality of second contacts, said method comprising the steps of:

• applying a first strip and second strip of liquid solder mask to a copper foil;
• plating exposed surfaces of the copper foil with at least one of an immersion silver and an immersion tin;
• trimming the copper foil into leads, each lead having a first end and a second end, the first end of each lead including a portion of the first strip of liquid solder mask and the second end of the lead including a portion of the second strip of liquid solder mask;
• attaching the first end of each lead to at least one first contact;
• folding the leads into a C-shape having a first leg and a second leg, the first leg and the second leg being substantially parallel with a curved portion between the first leg and the second leg, the first leg including the first end of the lead and the second leg including the second end of the lead;
• and
• attaching the second end of each lead to at least one second contact.

A method of electrically and mechanically connecting an circuit chip to a circuit board, the circuit chip having a plurality of first contacts and the circuit board having a plurality of second contacts, said method comprising the steps of:

• plating exposed surfaces of a mesh with at least one of an immersion silver and an immersion tin;
• trimming the mesh into leads, each lead having a first end and a second end;
• attaching the first end of each lead to at least one first contact;
• folding each of the leads into a C-shape having a first leg and a second leg, the first leg and the second leg being substantially parallel with a curved portion between the first leg and the second leg, the first leg including the first end of the lead and the second leg including the second end of the lead;
• and
• attaching the second end of each lead to at least one second contact.