Printed board with a pin for mounting a component
AssigneeIbiden Co., Ltd.
InventorsTakashi Kariya, Toshiki Furutani, Takeshi Kawanishi
Life of this patent
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Abstract
A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
Claims16
A printed circuit board including a component mounting pin made of a conductive material to connect with an electronic component.
An electronic device comprising:
- a printed circuit board with a component mounting pin;
- and
- an electronic component, wherein said component mounting pin is urged against an electrode pad of said electronic component.
An electronic device comprising:
- a printed circuit board with a component mounting pin;
- and
- an electronic component, wherein said component mounting pin is connected to an electrode pad of said electronic component by solder-joint through a solder bump.
A method of manufacturing a printed circuit board with a component mounting pin comprising the steps of:
- (a) a step for conveying a metal wire onto an electrode land of a printed circuit board attached to a suitable positioning apparatus;
- (b) a step for recognizing a land bonding point of said printed circuit board;
- (c) a step for compression-bonding and joining a tip end of a metal wire to said land bonding point;
- (d) a step for looping said metal wire;
- (e) a step for cutting said metal wire;
- (f) a step for forming a ball by fusing a tip end portion of said cut metal wire;
- and
- (g) a step for moving a metal wire to the next land of said printed circuit board.
Dependencies are inferred from the claim text.