Low-k dielectric layers for large substrates
OwnerMichael W. Stowell, Jose M. Dieguez-Campo +1inventors
InventorsMichael W. Stowell, Jose M. Dieguez-Campo, Michael Liehr
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Abstract
A system and method for producing a film is described. One embodiment of the process includes the following processes: providing a substrate comprising a glass plate, electrodes; and bus bars; heating the substrate to an approximate critical temperature; initiating the chemical vapor deposition process when the substrate is near the approximate critical temperature, thereby depositing a film on the substrate; maintaining the upper portion of the film at approximately the critical temperature while the chemical vapor deposition process is ongoing; terminating the chemical vapor deposition process once the film has reached a desired thickness; and cooling the substrate and the deposited film.
Claims30
A method for depositing a dielectric layer using PECVD, the method comprising:
- heating a substrate approximately to a critical temperature, wherein the critical temperature corresponds to a precursor gas;
- introducing the precursor gas into a process chamber at approximately the time that the substrate is near the critical temperature;
- disassociating the precursor gas, thereby forming deposition material;
- and
- depositing the deposition material to thereby form a film.
A method for creating a plasma display panel, the method comprising:
- providing a substrate comprising a glass plate, electrodes;
- and bus bars;
- heating the substrate to an approximate critical temperature;
- initiating the deposition process when the substrate is near the approximate critical temperature, thereby depositing a film;
- maintaining an upper portion of the film at approximately the critical temperature while the deposition process is ongoing;
- terminating the deposition process once the film has reached a desired thickness;
- and
- cooling the substrate and the deposited film.
A plasma display panel portion comprising:
- a glass layer;
- a plurality of electrodes;
- a plurality of bus bars;
- a dielectric layer deposited using a plasma enhanced chemical vapor deposition process;
- and
- a protective layer.
Dependencies are inferred from the claim text.