Conductive polymers for the electroplating

A method for patterning ultra-small features on a non-conductive surface comprising:

• providing a non-conductive substrate;
• forming a conductive layer on said non-conductive surface;
• depositing a layer of photoresist on said conductive layer;
• defining a pattern in said photoresist layer;
• etching desired portions of said conductive layer as defined by the patterned photoresist layer to thereby expose a portion of the non-conductive substrate;
• growing said ultra-small structures on the exposed portion of said non-conductive surface in an electroplating process;
• and
• removing the remaining portions of said conductive layer and said photoresist layer.

A method for patterning ultra-small features on a semi-conductive surface comprising:

• providing a semi-conductive surface having a conducting layer formed thereon;
• depositing a mask layer on said conductive layer;
• defining a pattern in said mask layer;
• etching desired portions of said conductive layer as defined by the patterned mask layer to thereby expose portions of the semi-conductive layer there beneath;
• growing said ultra-small structures on exposed said semi-conductive surface in a pulse-electroplating process;
• and
• removing the remaining portions of the conductive layer and the mask layer from the semi-conductive substrate and the ultra-small structures.

A method of patterning ultra-small structures on a surface, comprising:

• providing a substrate;
• forming a first, conductive layer on the substrate;
• forming a second layer on said first conductive layer;
• defining and forming a desired pattern in said second layer by removing portions thereof to expose surface portions of the first conductive layer;
• and
• growing ultra-small structures on the exposed surface portions of the first conductive layer in an electroplating process.