Methods, apparatus, and systems for causing fluid to flow through or into via holes, vents, and other openings or recesses that communicate with surfaces of substrates of semiconductor device components
AssigneeMicron Technology, Inc.
InventorRoss Dando
Life of this patent
Estimating the term…
Abstract
A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.
Claims34
A method for removing material from surfaces of at least a portion of at least one aperture that extends substantially through a substrate, comprising:
- positioning the substrate substantially along a boundary within a pressurizable chamber;
- and
- generating a pressure differential across the boundary, the pressure differential causing fluid on a first side of the chamber at a first side of the boundary to flow into the at least one aperture of the substrate toward the a second side of the chamber at a second side of the boundary.
A method for removing material from surfaces of at least one recess or at least one aperture extending into a surface of a substrate, comprising pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture.
An apparatus for generating pressure differential across a substrate, including:
- a pressurizable chamber;
- a boundary located between at least two regions of the pressurizable chamber;
- at least one substrate holder positionable substantially along the boundary and, when in position and assembled with a substrate, configured to substantially seal a first region on a first side of the boundary from a second region on a second side of the boundary;
- and
- a pressurization component associated with at least one of the first region and the second region.
An apparatus for removing material from at least a portion of at least one aperture or recess in a substrate, comprising:
- a source of fluid for dissolving or removing at least one material of the obstructions or irregularities;
- and
- a component for generating a pressure that causes the fluid to flow into or through the at least one aperture or recess.
Dependencies are inferred from the claim text.