Semiconductor device and manufacturing method thereof
AssigneeTokyo Electron Limited
InventorsGenji Nakamura, Yasushi Akasaka
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsGenji Nakamura, Yasushi Akasaka
Estimating the term…
In a method for manufacturing a semiconductor device, an insulating film is formed on an entire surface of a substrate having a device isolation region and a first and a second conductive region. Then, a semiconductor device structure having a gate electrode forming region is formed on each of the conductive regions, the insulating film being disposed between the gate electrode forming region and each of the conductive regions. A gate electrode groove is formed in the gate electrode forming region of the semiconductor device structure, the insulating film being removed in the gate electrode groove. Thereafter, a gate insulating film and a film of metal gate electrode material are deposited on a bottom surface and a side surface of the gate electrode groove and an alloy is formed by alloying the film of metal gate electrode material deposited in a gate electrode groove of the first conductive region.
A method for manufacturing a semiconductor device, comprising the steps of:
A method for manufacturing a semiconductor device, comprising the steps of:
A CMISFET (Complementary Metal Insulator Semiconductor Field Effect Transistor) semiconductor device comprising:
Dependencies are inferred from the claim text.