Semiconductor wafer and manufacturing method thereof
AssigneeOki Electric Industry Co., Ltd.
InventorHiroaki Uchida
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Abstract
The present invention provides a semiconductor wafer comprising an insulated board of sapphire or the like having translucency, which is provided with a positioning orientation flat at a peripheral portion thereof, and a silicon thin film formed over the entire one surface of the insulated board. In the semiconductor wafer, ions are implanted in an area containing the orientation flat at a peripheral portion of the silicon thin film to amorphize silicon. Thus, the translucency at the amorphized spot is eliminated and accurate positioning using the conventional optical sensor can be performed.
Claims4
1-10. (canceled)
A method of manufacturing a semiconductor wafer, comprising the steps of:
- sequentially forming a silicon thin film and an oxide silicon film over the entire one surface of an insulated board having a light-penetrating property, which is provided with a positioning orientation flat at a peripheral portion thereof;
- forming a silicon film having a rough surface over the entire surface of the insulated board, which is located on the side opposite to the formed surface of the silicon thin film, or at a peripheral portion of the oxide silicon film;
- and
- removing an exposed portion of the oxide silicon film,
- wherein said steps are sequentially performed.
Dependencies are inferred from the claim text.