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US 2007/0190699 A1Published application
Electronic device and method of manufacturing the same
AssigneeHitachi, Ltd.
InventorMitsuo USAMI
Life of this patent
Estimating the term…
Abstract
An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.
Claims2
A method of manufacturing an electronic device, comprising the steps of:
- providing an IC chip having a memory to store predetermined information and first and second external electrodes provided on front and back sides thereof, respectively;
- providing first and second antennae, each having a dumet at one end thereof;
- providing a glass tube;
- inserting a portion of the dumet of the first antenna into the glass tube;
- placing the IC chip on the dumet of the first antenna arranged in the glass tube such that the first external electrode is disposed on a side of the first antenna dumet;
- placing a portion of the dumet of the second antenna on the IC chip arranged in the glass tube such that the dumet of the second antenna is disposed on a side of the second external electrode;
- and
- melting the glass tube to fix the IC chip and the dumets of the first and second antennae.
5 more elements
2-33. (canceled)
Dependencies are inferred from the claim text.