Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
AssigneeST Assembly Test Services Ltd.
InventorsJeffrey Punzalan, Jae Hun Ku, Byung Joon Han
Life of this patent
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Abstract
A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. Electrical connections between the integrated circuit and the number of leads are made, and an encapsulant is formed over the integrated circuit and around the number of mold dams.
Claims20
A method of manufacturing a semiconductor comprising:
- providing a leadframe having a die attach paddle and a number of leads;
- forming a recess in the die attach paddle to provide a number of mold dams around the periphery of the die attach paddle;
- positioning an integrated circuit in the recess;
- forming electrical connections between the integrated circuit and the number of leads;
- and
- forming an encapsulant over the integrated circuit and around the number of mold dams.
A method of manufacturing a semiconductor comprising:
- providing a leadframe having a die attach paddle and a number of leads;
- etching a recess at least half way into the die attach paddle to provide a number of mold dams around the periphery of the die attach paddle;
- bonding an integrated circuit in the recess;
- wire bonding electrical connections between the integrated circuit and the number of leads;
- and
- forming an encapsulant over the integrated circuit and around the number of mold dams.
A semiconductor comprising:
- a leadframe having a die attach paddle and a number of leads;
- the die attach paddle having a recess to provide a number of mold dams around the periphery of the die attach paddle;
- an integrated circuit in the recess;
- electrical connections between the integrated circuit and the number of leads;
- and
- an encapsulant over the integrated circuit and around the number of mold dams.
A semiconductor comprising:
- a leadframe having a die attach paddle and a number of leads;
- the die attach paddle having a recess at least half way into the die attach paddle to provide a number of mold dams around the periphery of the die attach paddle;
- an integrated circuit in the recess;
- electrical connections between the integrated circuit and the number of leads;
- and
- an encapsulant over the integrated circuit and around the number of mold dams.
Dependencies are inferred from the claim text.