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US 2007/0190693 A1Published application
Semiconductor chip package having an adhesive tape attached on bonding wires
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Yeop Lee, Min-Il Kim
Life of this patent
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Abstract
The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
Claims10
1-12. (canceled)
A method of assembling a semiconductor chip package comprising:
- attaching a first semiconductor chip having a first surface and an active surface opposite the first surface on a mounting means;
- attaching a first plurality of bonding wires between chip pads arrayed within a perimeter of the active surface of the first semiconductor chip and mount pads arrayed on the mounting means, the first plurality of bonding wires establishing electrical connections between the first semiconductor chip and the mounting means;
- attaching a first adhesive tape to the active surface of the first semiconductor chip and to upper portions of the first plurality of bonding wires;
- and
- heating the first adhesive tape to a temperature sufficient to cause portions of the first adhesive tape to encapsulate the upper portions of the bonding wires within the first adhesive tape.
2 more elements
Dependencies are inferred from the claim text.