Integrated circuit package system with exposed interconnects
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Chow, Il Shim, Byung Han
Life of this patent
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Abstract
An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsulant on the substrate and leaving top portions of the interconnects exposed; attaching solder balls to the second surface; and singulating the substrate and the encapsulant into a plurality of integrated circuit packages.
Claims20
An integrated circuit package system comprising:
- providing a substrate having a first surface and a second surface;
- mounting interconnects to the first surface;
- mounting integrated circuit dies to the first surface;
- embedding the interconnects and the integrated circuit dies within an encapsulant on the substrate and leaving top portions of the interconnects exposed;
- attaching solder balls to the second surface;
- and
- singulating the substrate and the encapsulant into a plurality of integrated circuit packages.
An integrated circuit package system comprising:
- providing a substrate having wiring on a first surface and a second surface;
- mounting interconnects to the wiring on the first surface;
- mounting integrated circuit dies to the first surface;
- bonding wires between the integrated circuit dies and the wiring on the first surface;
- embedding the interconnects and the integrated circuit dies within an encapsulant on the substrate and leaving top portions of the interconnects exposed;
- attaching solder balls to the wiring on the second surface;
- and
- singulating the substrate and the encapsulant into a plurality of integrated circuit packages.
An integrated circuit package system comprising:
- a substrate having a first surface and a second surface and rounded or flat-top interconnects mounted to the first surface;
- an integrated circuit die mounted to the first surface;
- an encapsulant on the substrate embedding the interconnects and the integrated circuit die with top portions of the interconnects exposed;
- and
- solder balls mounted to the second surface.
Dependencies are inferred from the claim text.