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US 2007/0190687 A1Published application
Image sensor packaging structure and method of manufacturing the same
AssigneeIndustrial Technology Research Institute
InventorsShou-Lung CHEN, Fang-Jun LEU, Shan-Pu YU
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Abstract
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.
Claims9
A method for packaging an image sensor module, comprising:
- providing a first substrate;
- providing a second substrate;
- flip-chip bonding an image sensor device to the second substrate for receiving an image signal;
- and
- embedding a semiconductor device in the first substrate for processing the image signal from the image sensor device.
2 more elements
A method for packaging an image sensor module, comprising:
- providing a first substrate;
- attaching a semiconductor device onto the first substrate;
- forming a dielectric layer on the first substrate attached with the semiconductor device;
- patterning and etching the dielectric layer to expose parts of the first substrate and the semiconductor device;
- forming a conductive layer on the dielectric layer to cover at least one of the exposed parts;
- providing a second substrate;
- flip-chip bonding an image sensor device to the second substrate;
- and
- electrically connecting the image sensor and the semiconductor device.
6 more elements
Dependencies are inferred from the claim text.