Patterned electroless metallization processes for large area electronics

A method of forming a conductive feature on the surface of a substrate, comprising:

• depositing an organic containing material on a surface of a substrate;
• exposing the organic material and the surface of the substrate to a ruthenium tetroxide containing gas, wherein the ruthenium tetroxide oxidizes the organic material to selectively deposit a ruthenium containing layer on the surface of the substrate;
• and
• depositing a conductive layer on the ruthenium containing layer using an electroless deposition process.

A method of forming a conductive feature on the surface of a substrate, comprising:

• depositing a liquid coupling agent that contains a metal oxide precursor on a surface of a substrate;
• reducing the metal oxide precursor using a reducing agent;
• and
• depositing a conductive layer on the ruthenium containing layer using an electroless deposition process.

A method of forming a conductive feature on the surface of a substrate, comprising:

• forming a dielectric layer between two discrete devices formed on a substrate surface by depositing a polymeric material on the surface of the substrate;
• exposing the dielectric layer to a ruthenium tetroxide containing gas, wherein the ruthenium tetroxide oxidizes the surface of the dielectric layer to form a ruthenium containing layer;
• and
• depositing a conductive layer on the ruthenium containing layer using an electroless deposition process.