Low thermal expansion bondcoats for thermal barrier coatings

A thermal barrier coating for a metal or non-metal substrate comprising (i) a low thermal expansion bondcoat layer applied to said substrate comprising an alloy of MCrAlM′ wherein M is an element selected from nickel, cobalt, iron and mixtures thereof, and M′ is an element selected from yttrium, zirconium, hafnium, ytterbium and mixtures thereof, and wherein M comprises from about 35 to about 80 weight percent of said alloy, Cr comprises from about 15 to about 45 weight percent of said alloy, Al comprises from about 5 to about 30 weight percent of said alloy, and M′ comprises from about 0.01 to about 1.0 weight percent of said alloy, said alloy thermally sprayed from a powder having a mean particle size of 50 percentile point in distribution of from about 5 microns to about 100 microns, said bondcoat having a surface roughness of at least 200 micro-inches, and said bondcoat having a thermal expansion of about 6.5 millimeters per meter or less between a temperature of from about 25° C. to about 525° C., and (ii) a ceramic insulating layer applied to said bondcoat layer.

A method for minimizing or eliminating interface stress and crack formation in a ceramic insulating layer of a thermal barrier coating, said method comprising (i) applying a low thermal expansion bondcoat layer to a metal or non-metal substrate, said bondcoat layer comprising an alloy of MCrAlM′ wherein M is an element selected from nickel, cobalt, iron and mixtures thereof, and M′ is an element selected from yttrium, zirconium, hafnium, ytterbium and mixtures thereof, and wherein M comprises from about 35 to about 80 weight percent of said alloy, Cr comprises from about 15 to about 45 weight percent of said alloy, Al comprises from about 5 to about 30 weight percent of said alloy, and M′ comprises from about 0.01 to about 1.0 weight percent of said alloy, said alloy thermally sprayed from a powder having a mean particle size of 50 percentile point in distribution of from about 5 microns to about 100 microns, said bondcoat having a surface roughness of at least 200 micro-inches, and wherein said bondcoat layer has a thermal expansion of about 6.5 millimeters per meter or less between a temperature of from about 25° C. to about 525° C., and (ii) applying said ceramic insulating layer to said bondcoat layer.