Economical minaturized assembly and connection technology for leds and other optoelectronic modules
AssigneeOSRAM Opto Semiconductors GmbH
InventorsEwald Gunther, Jorg-Erich Sorg, Karl Weidner, Jorg Zapf
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Abstract
An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.
Claims20
1-13. (canceled)
An article of manufacture comprising:
- a substrate;
- and
- an optoelectronic component,
- wherein the optoelectronic component is contacted in a planar manner.
The article of manufacture according to claim 1, wherein the substrate has a conducting element with which the optoelectronic element is contacted in a planar manner.
A method of making an article of manufacture comprising a substrate and an optoelectronic component, the method comprising contacting the optoelectronic component in a planar manner.
An article of manufacture comprising:
- a substrate having a substrate contact;
- an optoelectronic component, said optoelectronic component having a central light exit and an edge contact disposed at least partially around a periphery of the light exit;
- and
- a conducting structure, arranged on the optoelectronic component and the substrate so as to contact the edge contact and the substrate contact.
Dependencies are inferred from the claim text.