Release layer paste and method of production of a multilayer type electronic device
AssigneeTDK Corporation
InventorsKyotaro Abe, Shigeki Sato
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AssigneeTDK Corporation
InventorsKyotaro Abe, Shigeki Sato
Estimating the term…
A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose, including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder with respect to the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).
A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm,
A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm,
Dependencies are inferred from the claim text.