US 2007/0185260 A1 · Heat-resisting silicone materials containing inorganic ceramic hollow microspheres

Abstract

The present invention relates to heat-resisting silicone materials containing inorganic ceramic hollow microspheres, which comprising an inorganic hollow microsphere substrate consisted of inorganic ceramic hollow microsphere, silicone rubber and other compounds, wherein the inorganic ceramic hollow microspheres with diameters of 80-100 μm, and complex ceramic powders of nano-grade. The silicone rubber has heat-resisting temperature up to 450° C., so that the heat-resisting temperature of resultant silicone materials of the invention may be raised to 450° C. even higher. Furthermore, the heat energy can be converted to thermal radiation with the broad wavelength in frequency domain of about 2-80 μm by the silicone materials of the invention.

Claims4

Dependent claims

A heat-resisting silicone materials containing inorganic ceramic hollow microspheres, which is characterized that made of:

an inorganic hollow microsphere substrate consisted of 10˜20% (v/v) of inorganic ceramic hollow microspheres, 40˜50% of silicone rubber, 5˜10% (v/v) of zirconium dioxide, 5˜15% (v/v) of aluminum oxide, 5˜15% (v/v) of silicon dioxide, 5˜15% (v/v) of zinc oxide, and 3˜7% (v/v) of barium titanate using the silicone rubber as binder, in which the inorganic ceramic hollow microspheres with diameters of 80-100 μm;
and
a complex ceramic fine powder of nanometers at 5˜15% (v/v) mixed with 85˜95% (v/v) of the inorganic hollow microsphere substrate.

Dependencies are inferred from the claim text.

Heat-resisting silicone materials containing inorganic ceramic hollow microspheres

Life of this patent

Heat-resisting silicone materials containing inorganic ceramic hollow microspheres

Life of this patent

Abstract

Claims4