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US 2007/0185244 A1Published application
Moulding composition for producing bipolar plates
AssigneeDuresco GmbH
InventorsMartin Spitzer, Philip Willis, Gunnar Reitmajer
Life of this patent
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Abstract
Compositions comprising (a) an epoxy resin, (b) a hardener for the epoxy resin, (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, and (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite, are particularly suitable for producing biopolar plates.
Claims23
1-15. (canceled)
A solvent-free composition comprising
- (a) an epoxy resin,
- (b) a hardener for the epoxy resin,
- (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, selected from the group consisting of an amine, a polyamine and an imidazole, and
- (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite.
1 more element
Dependencies are inferred from the claim text.