Printed circuit board
AssigneeCanon Kabushiki Kaisha
InventorKoji ISHIKAWA
Life of this patent
Estimating the term…
Abstract
A highly reliable printed circuit board which is capable of preventing a short circuit between traces from being caused by a solder bridge formed by excess solder. The printed circuit board has a solder resist covering copper foil traces formed on a substrate and the substrate, for insulation. The solder resist is formed such that exposed portions of the substrate between adjacent ones of the conductive traces each have a shape protruding in a direction of where the other printed circuit board is connected, with respect to exposed portions of the adjacent ones of the conductive traces, in a boundary between the connection part and a portion on which an insulating layer is formed.
Claims6
A printed circuit board comprising:
- a substrate as a base of a printed circuit board;
- a plurality of conductive traces formed on said substrate;
- an insulating layer covering said conductive traces and said substrate, for insulation;
- and
- a connection part for connection with another printed circuit board, said connection part being not covered with said insulating layer but having said conductive traces and said substrate exposed therefrom,
- wherein said insulating layer is formed such that exposed portions of said substrate between adjacent ones of said conductive traces each have a shape protruding in a direction of where the other printed circuit board is connected, with respect to exposed portions of the adjacent ones of said conductive traces, in a boundary between said connection part and a portion on which said insulating layer is formed.
A printed circuit board comprising:
- a substrate as a base of a printed circuit board;
- a plurality of conductive traces formed on said substrate;
- an insulating layer covering said conductive traces and said substrate, for insulation;
- and
- a connection part for connection with another printed circuit board, said connection part being not covered with said insulating layer but having said conductive traces and said substrate exposed therefrom,
- wherein said insulating layer is formed such that portions for covering between said conductive traces on said substrate each have a shape recessed in a direction of where the other printed circuit board is connected, with respect to portions for covering said conductive traces, in a boundary between said connection part and a portion on which said insulating layer is formed.
A printed circuit board comprising:
- a substrate as a base of a printed circuit board;
- a plurality of conductive traces formed on said substrate;
- an insulating layer covering said conductive traces and said substrate, for insulation;
- and
- a connection part for connection with another printed circuit board, said connection part being not covered with said insulating layer but having said conductive traces and said substrate exposed therefrom,
- wherein said insulating layer is formed such that substrate portions between said insulated conductive traces are exposed in a boundary between said connection part and a portion on which said insulating layer is formed.
Dependencies are inferred from the claim text.