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US 2007/0184633 A1Published application
Method of segmenting wafer
OwnerChen-Hsiung Yanginventor
Life of this patent
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Abstract
A wafer is provided and a front scribe line pattern is defined on a front surface of the wafer. A back scribe line pattern corresponding to the front scribe line pattern is defined on a back surface of the wafer. Then the wafer is attached to an extendable film and a wafer breaking process is performed to form a plurality of dies by virtue by extending the extendable film.
Claims12
A method of segmenting wafer comprising:
- providing a wafer;
- defining a front scribe line pattern on a front surface of the wafer;
- defining a back scribe line pattern corresponding to the front scribe line pattern on a back surface of the wafer;
- and
- attaching the wafer to an extendable film and performing a wafer breaking process to form a plurality of dies by virtue of extending the extendable film.
2 more elements
A method of segmenting wafer comprising:
- providing a wafer comprising a structural layer on a front surface thereof;
- defining a front scribe line pattern on the structural layer, the wafer having a thickness greater than a depth of the front scribe line pattern;
- performing an etching process to define a back scribe line pattern corresponding to the front scribe line pattern on a back surface of the wafer, and to form a plurality of cavities exposing the structural layer and a plurality of hanged membrane structures;
- and
- attaching the wafer to an extendable film, and accordingly performing a wafer breaking process by virtue of extending the extendable film to break the wafer and form a plurality of dies.
2 more elements
Dependencies are inferred from the claim text.