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US 2007/0184630 A1Published application
Method of bonding a semiconductor wafer to a support substrate
OwnerJohn Cullen, Suzanne Combeinventors
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Abstract
A method of bonding a semiconductor wafer to a support substrate comprising the steps of: providing a semiconductor wafer; coating at least part of one face of the wafer with a water soluble coating layer; providing a double sided adhesive tape, at least one side of the adhesive tape comprising a thermal release adhesive; adhering the double sided adhesive tape to coating layer by means of said thermal release adhesive; adhering the reverse side of the adhesive tape to the support substrate.
Claims13
A method of bonding a semiconductor wafer to a support substrate comprising the steps of:
- providing a semiconductor wafer;
- coating at least part of one face of the wafer with a water soluble coating layer;
- providing a double sided adhesive tape, at least one side of the adhesive tape comprising a thermal release adhesive;
- adhering the double sided adhesive tape to coating layer by means of said thermal release adhesive;
- adhering the reverse side of the adhesive tape to the support substrate.
2 more elements
A bonded structure comprising:
- a semiconductor wafer;
- a wafer soluble coating layer on one side of the wafer;
- a double sided adhesive tape, at least one side of which comprises a thermal release adhesive, the adhesive tape being adhered to the coating layer by means of the thermal release adhesive;
- and
- a substrate adhered to the opposite side of the adhesive layer.
2 more elements
Dependencies are inferred from the claim text.