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US 2007/0184604 A1Published application
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
AssigneeNEC Electronics Corporation
InventorHirokazu Honda
Life of this patent
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Abstract
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.
Claims20
A method of forming an interconnection board, wherein during formation of said interconnection board, said interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than said interconnection board for suppressing said interconnection board from being bent.
Dependencies are inferred from the claim text.