Method for manufacturing physical quantity sensor

Abstract

A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is connected to the rectangular frame portion by connecting leads; fixing a physical quantity sensor chip to the stage portion; inclining the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion; and integrating the inclined physical quantity sensor chip and the leads within a metallic mold using a resin. The method further comprises the steps of providing a pressing member of a separate body to the stage portion on the back face of the stage portion in order to incline the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion, and inclining the stage portion and the physical quantity sensor chip by pressing of the back face of the stage portion by the pressing member.

Dependencies are inferred from the claim text.