Method for fabricating semiconductor package
AssigneeOki Electric Industry Co., Ltd.
InventorYoshimi Egawa
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Abstract
According to this invention, a method for fabricating a semiconductor package, in which a plurality of semiconductor chips having a through electrode is layered on a semiconductor interposer, comprising: mounting and layering a plurality of semiconductor chips on a first surface of a semiconductor wafer, which is to be used for a semiconductor interposer; forming a mold resin over the semiconductor chips to cover the semiconductor chips entirely; and dicing the semiconductor wafer to form a plurality of individual semiconductor packages.
Claims9
A method for fabricating a semiconductor package, in which a plurality of semiconductor chips having a through electrode is layered on a semiconductor interposer, comprising:
- mounting and layering a plurality of semiconductor chips on a first surface of a semiconductor wafer, which is to be used for a semiconductor interposer;
- forming a mold resin over the semiconductor chips to cover the semiconductor chips entirely;
- and
- dicing the semiconductor wafer to form a plurality of individual semiconductor packages.
Dependencies are inferred from the claim text.