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US 2007/0184578 A1Published application
Solder bump confinement system for an integrated circuit package
AssigneeSTATS ChipPAC, Ltd.
InventorsYaojian Lin, Pandi Chelvam Marimuthu, Rajendra D. Pendse
Life of this patent
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Abstract
A solder bump confinement system is provided including providing a substrate, patterning a contact material on the substrate, depositing an inner passivation layer over the contact material and the substrate, forming an under bump material defining layer over the contact material by sputtering, and forming a system interconnect over the contact material and on the under bump material defining layer.
Claims20
A solder bump confinement system comprising:
- providing a substrate;
- patterning a contact material on the substrate;
- depositing an inner passivation layer over the contact material and the substrate;
- forming an under bump material defining layer over the contact material by sputtering;
- and
- forming a system interconnect over the contact material and on the under bump material defining layer.
3 more elements
A solder bump confinement system comprising:
- providing a substrate in which the substrate includes a semiconductor wafer, a MEMS wafer, or a printed circuit board;
- patterning a contact material on the substrate;
- depositing an inner passivation layer over the contact material and the substrate;
- forming an under bump material defining layer over the contact material by sputtering including the under bump material defining layer having a thickness in the range of 200 Angstrom to 1500 Angstrom;
- and
- forming a system interconnect over the contact material and on the under bump material defining layer.
3 more elements
A solder bump confinement system comprising:
- a substrate;
- a contact material patterned on the substrate;
- an inner passivation layer deposited over the contact material and the substrate;
- an under bump material defining layer over the contact material in which the under bump material defining layer has a thickness in the range of 200 Angstrom to 1500 Angstrom;
- and
- a system interconnect formed over the contact material and on the under bump material defining layer.
3 more elements
Dependencies are inferred from the claim text.