Cooling devices for various applications

Abstract

The figure displays the diagram of a laminar flow water cooler (110) for a microprocessor comprising an integral radiator (112) provided with thin-walled and hollow fins which are produced by controlled compression of double convex bellows of a polymer or glass hot-blown blank. In order to form a closed circuit filled with water at the atmospheric pressure, the manifolds (113, 114, 115) of the radiator (112) are connected to the manifolds of an original component (114) formed by a mini heater (116) provided with a copper heating plate with internal grooved face and a mini pump (118) provided with a brushless electric motor devoid of a centrifugal turbine, wherein said mini heater and mini pump are disposed in a rigid small-sized moulded polymer hose. The total thermal resistance of said cooler can be equal to 0.15°/W that is of interest, in particular for high performance microprocessors for dissipating more than 200 W through the very hot central area of 1.5 cm2 of the heat dissipating surface thereof. The concept of the production of the inventive cooler makes it possible to design efficient and low-cost cooling devices which are usable for microprocessors, high-power electronic devices, thermal engines or fuel cells, in particular mounted in a motor vehicle. Said invention can be used for cooling any component dissipating a given thermal flux within the determined power and temperature limits.

Dependencies are inferred from the claim text.