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AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Ki LEE, Byung-Uk KIM, Hyoc-Min YOUN
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Disclosed herein is a resin composition for an organic insulating layer, a method of manufacturing the same, and a display panel including an insulating layer formed using the resin composition. The resin composition for an organic insulating layer is produced by polymerizing about 5 to about 35 wt % of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, about 5 to about 40 wt % of a styrene compound, about 5 to about 40 wt % of an epoxy compound, about 0.1 to about 10 wt % of an isobornyl compound, and about 20 to about 40 wt % of a dicyclopentadiene compound, based on the total weight of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, styrene compound, isobornyl compound, and dicyclopentadiene compound.
A resin composition for an organic insulating layer produced by polymerizing about 5 to about 35 wt % of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, about 5 to about 40 wt % of a styrene compound, about 5 to about 40 wt % of an epoxy compound, about 0.1 to about 10 wt % of an isobornyl compound, and about 20 to about 40 wt % of a dicyclopentadiene compound based on the total weight of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, styrene compound, epoxy compound, isobornyl compound, and dicyclopentadiene compound.
A method of manufacturing a resin composition for an organic insulating layer, the method comprising:
A display panel comprising:
Dependencies are inferred from the claim text.