US 2007/0184289 A1 · Thermally and electrically conductive interface

Abstract

A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.

Claims20

Dependent claims

A method of manufacturing a high or low frequency circuit board assembly having improved heat dissipation functionality comprising:

providing a thermally and electrically conductive interface film including:
a first side and a second side wherein the interface film comprises dimethyl polysiloxane, fire retardant, metal flakes and/or particles, a peroxide based catalyst, a first release layer protecting the first side, and a second release layer protecting the second side;
removing the release layers;
sandwiching the interface between a metal base layer of a printed circuit board and a planar side of a heat sink to form the assembly;
in a hot press, applying a low pressure treatment to the assembly to increase surface contact and to remove air pockets;
in the above hot press, applying a high pressure treatment to the assembly at a high temperature to cure the interface and create a bonded laminate;
and
in a cold press, applying a low pressure treatment to the assembly at a low temperature to controllably return the assembly to room temperature.

5 more elements

Dependencies are inferred from the claim text.

Thermally and electrically conductive interface

Life of this patent

Thermally and electrically conductive interface

Life of this patent

Abstract

Claims20