Expoxy resin
AssigneeHuntsman Advanced Materials Americas LLC
InventorFrans Setiabudi
Life of this patent
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Abstract
Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 1O° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
Claims5
1-10. (canceled)
Process for the preparation of prepregs, characterized in that a reinforcing material is impregnated with a composition containing
- (a) a liquid epoxy resin,
- (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine,
- (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min),
- (d) a photopolymerizable compound and
- (e) a photoinitiator wherein the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7
- and exposed to actinic radiation until the material solidifies by photopolymerization of the photopolymerizable compound (d) to give a substantially solid layer.
Dependencies are inferred from the claim text.