Non-metal mesh cover for metal chassis
AssigneeVIA Technologies, Inc. of R.O.C.
InventorShih-Chang Ku
Life of this patent
Estimating the term…
Abstract
The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.
Claims20
A composite chassis having a higher skin temperature allowance than a metal chassis for an electronic system containing a plurality of electronic components therein, the chassis comprising:
- at least one metal panel for dissipating heat generated by the plurality of the electronic components;
- and
- at least one nonmetal mesh cover attached to an outer surface of the metal panel having a plurality of openings for preventing direct human contact with the metal panel and obtaining an additional skin temperature allowance.
A method for forming a composite chassis having a higher skin temperature allowance than a metal chassis for an electronic system containing a plurality of electronic components therein, the method comprising:
- placing a plurality of electronic components within the metal chassis;
- and
- providing a nonmetal mesh cover having a plurality of openings on at least a portion of an outer surface of the metal panel by securely attaching the nonmetal mesh cover to the metal panel to prevent a direct human contact with the metal panel and provide additional chassis skin temperature allowance.
A chassis having a higher skin temperature allowance than a metal chassis for an electronic system containing a plurality of electronic components therein, the chassis comprising:
- one or more metal panels having an opening;
- and
- a nonmetal mesh enclosing a metal mesh, wherein the nonmetal mesh has a higher skin temperature allowance than the metal mesh,
- wherein the nonmetal mesh enclosing the metal mesh is securely attached to the opening for dissipating heat.
Dependencies are inferred from the claim text.