Cover tape, and carrier tape system for packing electronic component
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsTakeshi Ono, Masanori Higano, Masanori Ishii, Takayuki Iwasaki
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Abstract
A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 μm, and has an antistatic agent applied thereon to form an antistatic layer.
Claims11
A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 μm, and has an antistatic agent applied thereon to form an antistatic layer.
Dependencies are inferred from the claim text.