Apparatus and method for depositing thin film

An apparatus for depositing a thin film, comprising:

• a vertical tube having an inner chamber and an outer chamber for receiving the inner chamber;
• a loadlock chamber combined with a lower portion of the vertical tube;
• a boat for receiving a plurality of wafers, the boat disposed to move vertically between the inner chamber and the loadlock chamber;
• a plasma generator disposed in the inner chamber, the plasma generator further comprising a plurality of injection holes and a plurality of vertical electrodes;
• a heater disposed in the outer chamber to heat the inner chamber;
• a gas supply unit for supplying the gas between the vertical electrodes in the plasma generator;
• a power source for supplying electrical power to at least one of the plurality of the vertical electrodes;
• and
• an exhaust portion disposed to remove the plasma from the inner chamber.

A method of depositing a thin film, comprising:

• providing a wafer into a thin film apparatus;
• rotating the wafer;
• flowing a thin film plasma from a first edge of the wafer to a second edge of the wafer via a center of the wafer;
• depositing a first thin film on the wafer;
• creating a temperature gradient within the thin film apparatus, wherein the temperature at the center of the wafer is higher than the temperature at the edges of the wafer;
• and
• depositing a second thin film on the wafer.