Substrate processing apparatus
OwnerChristopher Hofmeister, Robert Caveneyinventors
Life of this patent
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Abstract
A semiconductor workpiece processing apparatus having a first chamber, a transport vehicle, and another chamber. The first chamber is capable of being isolated from an outside atmosphere. The transport vehicle is located in the first chamber and is movably supported from the first chamber for moving linearly relative to the first chamber. The transport vehicle includes a base, and an integral semiconductor workpiece transfer arm movably mounted to the base and capable of multi-access movement relative to the base. The other chamber is communicably connected to the first chamber via a closable opening of the first chamber. The opening is sized to allow the transport vehicle to transit between the first chamber and the other chamber through the opening.
Claims155
A wafer fabrication method comprising:
- providing a processing module having an operating temperature substantially above an ambient temperature;
- receiving a wafer for introduction into the processing module, the wafer having a temperature near the ambient temperature;
- and
- heating the wafer to a temperature that is closer to the operating temperature.
A wafer fabrication system comprising:
- a processing module having an operating temperature substantially above an ambient temperature;
- a wafer for introduction into the processing module, the wafer having a temperature near the ambient temperature;
- and
- a heating facility for heating the wafer to a temperature that is closer to the operating temperature.
A wafer fabrication system comprising:
- a processing module having an operating temperature substantially above an ambient temperature;
- and
- a material handler that heats a wafer to a temperature that is closer to the operating temperature before introducing the wafer into the processing module.
A semiconductor handling method, comprising:
- providing a load lock for delivering items to or receiving items from a vacuum-based semiconductor handling system;
- and
- heating the load lock to dry the items.
A semiconductor handling system comprising:
- a load lock for delivering items to or receiving items from a vacuum-based semiconductor handling system;
- and
- a heating element for heating the load lock to dry the items.
A semiconductor manufacturing system comprising:
- a plurality of vertically stacked loading stations;
- and
- a plurality of vertically stacked processing modules, wherein a semiconductor manufacturing material is passed in a vacuum between the processing modules.
A method for arranging processing modules in a semiconductor manufacturing system comprising:
- providing a plurality of process modules;
- arranging at least two of the plurality of processing modules so that they are horizontally adjacent;
- and
- arranging at least two of the plurality of processing modules so that they are vertically adjacent, wherein the system handles semiconductor manufacturing materials in a vacuum between the process modules.
A computer-based method for controlling a semiconductor handling system, comprising:
- providing a robotic handling facility for handling a semiconductor item;
- providing a process module for processing an item;
- providing a software controller for the robotic handling facility;
- and
- providing an interface to the software controller, so that the controller recognizes at least one of the robotic handling facility and the process module when the same is connected to the semiconductor handling system.
A computer-based system for controlling a semiconductor handling system, comprising:
- a robotic handling facility for handling a semiconductor item;
- a process module for processing an item;
- a software controller for the robotic handling facility;
- and
- an interface to the software controller, so that the controller recognizes at least one of the robotic handling facility and the process module when the same is connected to the semiconductor handling system.
A computer-based method, comprising:
- providing a vacuum-based handling system for a material, the handling system including one or more robotic components;
- and
- providing a software interface for the handling system, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
A computer-based system, comprising:
- a vacuum-based handling system for a material, the handling system including one or more robotic components;
- and
- a software interface for the handling system, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
A system comprising:
- a plurality of processing modules, each processing module performing one or more fabrication processes on a workpiece, the processing modules arranged for sequential processing of the workpiece in a sequence from a first processing module to a last processing module;
- and
- a mid-entry point between the first processing module and the last processing module configured to at least one of add a workpiece to the sequence and remove a workpiece from the sequence at the mid-entry point.
A method for processing a workpiece comprising:
- arranging a plurality of processing modules in a sequence to sequentially operate on a workpiece;
- connecting two of the processing modules through a mid-entry point;
- and
- adding a workpiece to the sequence at the mid-entry point.
A method for processing a workpiece comprising:
- arranging a plurality of processing modules in a sequence to sequentially operate on a workpiece;
- connecting two of the processing modules through a mid-entry point;
- and
- removing a workpiece from the sequence at the mid-entry point.
A method comprising:
- providing a plurality of vacuum-based processing modules about a substantially linear axis between a loading end and an exit end;
- and
- providing an intermediate load lock facility for depositing items to or removing items from the vacuum-based processing modules between the loading end and the exit end.
A system comprising:
- a plurality of processing modules arranged in a sequence to sequentially operate on a workpiece;
- connecting means for connecting two of the processing modules through a mid-entry point;
- and
- adding means for adding a workpiece to the sequence at the mid-entry point.
A system comprising:
- a plurality of processing modules arranged in a sequence to sequentially operate on a workpiece;
- connecting means for connecting two of the processing modules through a mid-entry point;
- and removing means for removing a workpiece to the sequence at the mid-entry point.
A semiconductor handling system comprising:
- a series of vacuum-based process modules for processing itches;
- and
- a pair of load locks for delivering items to and taking items from one or more of the vacuum-based process modules, wherein the load locks are disposed in a vertical stack in proximity to one or more of the vacuum-based process modules.
Dependencies are inferred from the claim text.