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AssigneeDotworkz Systems, Inc.
InventorsCyrus Baldwin, Zachary Saielli, Mark Creighton
Estimating the term…
An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.
An electronic device enclosure for an articulating electronic device, the enclosure comprising:
An enclosure for an articulating electronic device, the enclosure comprising:
An electronic device assembly comprising:
A method of manufacturing an enclosure for an articulating electronic device, the method comprising the steps of:
(canceled)
(canceled)
Dependencies are inferred from the claim text.