Method of Manufacturing Ball Array Devices Using an Inspection Apparatus Having One or More Cameras and Ball Array Devices Produced According to the Method
OwnerElwin Beaty, David Morkinventors
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Abstract
An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.
Claims36
A method of manufacturing a ball array device having a plurality of leads, the method comprising:
- providing a fixed optical imaging system comprising at least one camera;
- calibrating the fixed optical imaging system with a planar precision pattern disposed in a fixed position;
- obtaining a single bottom view image of the leads using the calibrated system;
- obtaining a single side view image of the leads using the calibrated system;
- calculating an inspection result by combining information from the single bottom view image and the single side view image;
- and
- selecting the ball array device as a manufactured product using the calculated inspection result.
A method of manufacturing a ball array device having a plurality of leads, the method comprising:
- providing a fixed optical imaging system comprising at least one camera;
- calibrating the fixed optical imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining a bottom view image comprising donut shaped reflections from the leads using the calibrated system;
- obtaining a side view image comprising crescent shaped reflections from the leads using the calibrated system;
- finding locations of the donut shaped reflections from the leads;
- finding locations of the crescent shaped reflections from the leads;
- calculating a Z value for each lead by combining information from the locations of the donut shaped reflections and the locations of the crescent shaped reflections;
- calculating a coplanarity value for the ball array device by using the Z value for each lead;
- and
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A method of manufacturing a ball array device having a plurality of leads, the method comprising:
- providing an imaging system with at least one camera, at least one lens, at least one illumination source, at least one processor and memory;
- obtaining a single bottom view image of the leads using the imaging system;
- obtaining a single side view image of the leads using the imaging system;
- finding a subpixel location of each lead in the single bottom view image;
- finding a subpixel location of each lead in the single side view image;
- calculating a Z value for each lead by combining information from the subpixel location of the lead in the single bottom view image and the subpixel location of the same lead in the single side view image;
- calculating a coplanarity value for the ball array device by using information from the Z value of each lead and parameters determined during a calibration;
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A method of manufacturing a ball array device having a plurality of leads, the method comprising:
- providing a fixed optical imaging system comprising at least one camera, at least one lens, at least one illumination source, at least one processor and memory;
- calibrating the imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining a single bottom view image of the leads using the calibrated imaging system;
- obtaining a single side view image of the leads using the calibrated imaging system;
- finding a subpixel location of a reflection from each lead in the single bottom view image;
- finding a subpixel location of a reflection from each lead in the single side view image;
- calculating a Z value for each lead by combining information from the subpixel location of a reflection from the lead in the single bottom view image and the subpixel location of the reflection from the same lead in the single side view image;
- calculating a coplanarity value for the ball array device by using information from the Z value of each lead;
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A method of manufacturing a ball array device having a plurality of leads, the method comprising:
- providing an imaging system comprising at least one camera;
- calibrating the imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining two differing views of the leads in at least one image using the calibrated imaging system;
- obtaining a donut shaped reflection from each lead and a crescent shaped reflection from each lead in the at least one image;
- finding at least two reference positions of each lead in the at least one image;
- calculating a Z value of each lead using the at least two reference positions of each lead;
- calculating a coplanarity value using information from the Z value of each lead;
- determining an inspection result by comparing the coplanarity value to a tolerance value;
- and
- selecting the ball array device as a manufactured product depending upon the inspection result.
A ball array device having a plurality of leads, the device being produced according to a process comprising:
- providing a fixed optical imaging system comprising at least one camera;
- calibrating the fixed optical imaging system with a planar precision pattern disposed in a fixed position;
- obtaining a single bottom view image of the leads using the calibrated system;
- obtaining a single side view image of the leads using the calibrated system;
- calculating an inspection result by combining information from the single bottom view image and the single side view image;
- and
- selecting the ball array device as a manufactured product using the calculated inspection result.
A ball array device having a plurality of leads, the device being produced according to a process comprising:
- providing a fixed optical imaging system comprising at least one camera;
- calibrating the fixed optical imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining a bottom view image comprising donut shaped reflections from the leads using the calibrated system;
- obtaining a side view image comprising crescent shaped reflections from the leads using the calibrated system;
- finding locations of the donut shaped reflections from the leads;
- finding locations of the crescent shaped reflections from the leads;
- calculating a Z value for each lead by combining information from the locations of the donut shaped reflections and the locations of the crescent shaped reflections;
- calculating a coplanarity value for the ball array device by using the Z value for each lead;
- and
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A ball array device having a plurality of leads, the device being produced according to a process comprising:
- providing an imaging system with at least one camera, at least one lens, at least one illumination source, at least one processor and memory;
- obtaining a single bottom view image of the leads using the imaging system;
- obtaining a single side view image of the leads using the imaging system;
- finding a subpixel location of each lead in the single bottom view image;
- finding a subpixel location of each lead in the single side view image;
- calculating a Z value for each lead by combining information from the subpixel location of the lead in the single bottom view image and the subpixel location of the same lead in the single side view image;
- calculating a coplanarity value for the ball array device by using information from the Z value of each lead and parameters determined during a calibration;
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A ball array device having a plurality of leads, the device being produced according to a process comprising:
- providing a fixed optical imaging system comprising at least one camera, at least one lens, at least one illumination source, at least one processor and memory;
- calibrating the imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining a single bottom view image of the leads using the calibrated imaging system;
- obtaining a single side view image of the leads using the calibrated imaging system;
- finding a subpixel location of a reflection from each lead in the single bottom view image;
- finding a subpixel location of a reflection from each lead in the single side view image;
- calculating a Z value for each lead by combining information from the subpixel location of a reflection from the lead in the single bottom view image and the subpixel location of the reflection from the same lead in the single side view image;
- calculating a coplanarity value for the ball array device by using information from the Z value of each lead;
- determining an inspection result by comparing the coplanarity value to a predetermined tolerance value;
- and
- selecting the ball array device based upon the inspection result.
A ball array device having a plurality of leads, the device being produced according to a process comprising:
- providing an imaging system comprising at least one camera;
- calibrating the imaging system with a planar precision pattern disposed in a fixed focus position;
- obtaining two differing views of the leads in at least one image using the calibrated imaging system;
- obtaining a donut shaped reflection from each lead and a crescent shaped reflection from each lead in the at least one image;
- finding at least two reference positions of each lead in the at least one image;
- calculating a Z value of each lead using the at least two reference positions of each lead;
- calculating a coplanarity value using information from the Z value of each lead;
- determining an inspection result by comparing the coplanarity value to a tolerance value;
- and
- selecting the ball array device as a manufactured product depending upon the inspection result.
Dependencies are inferred from the claim text.