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US 2007/0183229 A1Published application
Multi chip package and related method
OwnerSeouk-Kyu Choi, Woo-Pyo Jeonginventors
Life of this patent
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Abstract
A Multi Chip Package (MCP) and a related method for enabling a cell in the MCP are provided. In one embodiment, the MCP comprises a first memory device and a second memory device storing repair address information about the first memory device.
Claims7
A multi chip package comprising:
- a first memory device;
- and,
- a second memory device storing repair address information about the first memory device.
A method for enabling a cell in a multi chip package comprising a first memory device and a second memory device storing repair address information about the first memory device, the method comprising:
- determining whether a first address is a repair address, wherein the first address is an address of a normal cell disposed in the first memory device;
- reading the repair address information from the second memory device when the first address is a repair address;
- and,
- enabling a redundancy cell in the first memory device in accordance with the repair address information when the first address is a repair address.
1 more element
Dependencies are inferred from the claim text.