Method of inspecting laminated assembly and method of inspecting heat spreader module

Abstract

A heat spreader module includes a laminated assembly, a heat spreader bonded to an upper surface of the laminated assembly, and a circuit board bonded to an upper surface of the heat spreader. The laminated assembly includes a base, an insulated substrate bonded to an upper surface of the base, and an intermediate metal plate bonded to an upper surface of the insulated substrate. A nonwoven fabric impregnated with a liquid is prepared, and an exposed portion of the insulated substrate, which extends out from below the intermediate metal plate, is wiped with the nonwoven fabric. Then, the entire structure is dried until the liquid on the exposed portion of the insulated substrate is removed. Thereafter, a pulsed voltage is applied between the circuit board and the base.

Dependencies are inferred from the claim text.