Protective layer for CMP assisted lift-off process and method of fabrication
OwnerQuang Le, Jui-Lung Li +1inventors
InventorsQuang Le, Jui-Lung Li, Yi Zheng
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Abstract
A magnetic head is disclosed having a write head with an encapsulated protected pole structure, which includes a P3 pole tip. A protective layer surrounds at least a portion of the P3 pole tip, and an encapsulating material layer surrounds a portion of the protective layer. Also disclosed is a method of fabrication for a write head with an encapsulated protected pole structure.
Claims32
A magnetic head including a write head with a protected pole structure, comprising:
- a P3 pole tip;
- and
- a non-magnetic protective layer surrounding a portion of said P3 pole tip.
A magnetic head including a write head with an encapsulated protected pole structure, comprising:
- a P3 pole tip;
- a protective layer surrounding at least a portion of said P3 pole tip;
- and
- an encapsulating material layer surrounding a portion of said protective layer.
A disk drive comprising:
- at least one hard disk;
- at least one magnetic head adapted to fly over said hard disk for reading data from said hard disk, said magnetic head including a write head with protected pole structure, including:
- a P3 pole tip;
- and
- a non-magnetic protective layer surrounding a portion of said P3 pole tip.
A method for fabricating a write head for perpendicular recording having an encapsulated protected pole structure, comprising:
- A) fabricating a P1, coils and P2 layer;
- B) forming a P3 layer on said P2 layer;
- C) forming a CMP stop layer on said P3 layer;
- D) forming at least one hard mask layer on said CMP stop layer;
- E) shaping portions of said P3 layer into a P3 pole tip;
- F) enclosing a portion of said P3 pole tip in a protective layer;
- G) forming an encapsulating material layer around at least a portion of said protective layer;
- H) removing said at least one hard mask layer;
- and
- I) planarizing said encapsulating material.
Dependencies are inferred from the claim text.