Rfid antenna on multiple sides of 3-d packaging

An RFID system, comprising:

• a packaging substrate having a first surface on a first plane and a second surface on a second plane;
• an antenna formed on the packaging substrate that includes a first conductive trace and at least one second conductive trace;
• and
• an integrated circuit that is connected across the first conductive trace and the at least one second conductive trace on the first surface, wherein at least one of the conductive traces extends outward from the integrated circuit and is formed on the first surface and the second surface.

A method of printing an RFID antenna operable to function in three dimensions, comprising:

• forming an antenna that includes a first conductive trace and at least one second conductive trace on an unfolded packaging substrate having a first surface and at least one second surface;
• connecting an integrated circuit across the first conductive trace and the at least one second conductive trace;
• and
• forming the unfolded packaging substrate into a package wherein the first surface and the at least one second surface are not coplanar, and wherein the integrated circuit and portions of the first conductive trace and the at least one second conductive trace are formed on the first surface and a portion of at least one of the first and/or the at least one second conductive trace is formed on the at least one second surface.