Stacked stripline circuits

A method for making an electronic device comprising:

• a. preparing a circuit board of predetermined dimensions for layering stacked circuits above a board substrate, comprising forming a ground layer and signal traces for connection to the stacked circuits and adapted for coupling with conductive elements not part of the device;
• b. layering a first high frequency stripline passive circuit above the circuit board, and coupling the first circuit to first signal launch points on the outer ground layer by a plurality of vias from the first circuit layer;
• and
• c. layering at least a second high frequency stripline passive circuit above the first circuit and coupling the second stripline circuit to second signal launch points on the outer ground layer by vias from the second circuit layer;
• whereby the first and second circuits form a 2-circuit stacked stripline integrated circuit.

An electronic assembly comprising:

• a main board;
• and
• an integrated circuit surface mounted to the main board, the integrated circuit surface comprising:
• a. a circuit board;
• b. a first high frequency stripline passive circuit layer located above the circuit board comprising a signal trace layer and a first ground layer located below the signal trace layer and a second ground layer located above the signal trace layer;
• and
• c. a second high frequency stripline passive circuit layer stacked above the first high frequency circuit, the second layer comprising a second signal trace layer above the second ground layer and a third ground layer above the second signal trace layer, whereby the second ground layer forms a ground layer for both the first and second circuit;
• wherein the stripline circuits each form at least one of a group of a filter, an inductor, a transformer, a phase shifter, an attenuator, and a switch, and are operable in the range of 1 to 4 GHz.

An electronic circuit board device comprising plural high frequency circuit layers each comprising a stripline passive circuit, wherein a first high frequency circuit layer comprises a first stripline passive circuit;

• and
• a second high frequency circuit layer stacked adjacent to the first high frequency circuit layer comprises a second stripline passive circuit, having a ground layer between the first and second stripline passive circuits;
• and
• subsequent high frequency circuit layers stacked adjacent to the second layer in a same manner.