Multi-band filter module and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-kwon Park, In-sang Song, Chul-soo Kim, Kuang-woo Nam
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Abstract
A multi-band filter module and a method of fabricating the same are disclosed. At least one upper filter is deposited on an upper surface of a first substrate. The first packaging substrate packages the upper filter deposited on the first substrate. At least one lower filter is deposited on an upper surface of the second substrate. The second packaging substrate packages the lower filter deposited on the second substrate. The lower surface of the first substrate is joined to a lower surface of the second substrate to face each other.
Claims22
A multi-band filter module comprising:
- a first substrate with at least one upper filter deposited on an upper surface of the first substrate;
- a first packaging substrate packaging the at least one upper filter deposited on the first substrate;
- a second substrate with at least one lower filter deposited on an upper surface of the second substrate;
- and
- a second packaging substrate packaging the at least one lower filter deposited on the second substrate;
- wherein a lower surface of the first substrate is joined to a lower surface of the second substrate to face each other.
A method of fabricating a multi-band filter module, the method comprising:
- (a) depositing at least one upper filter on an upper surface of a first substrate;
- (b) packaging the at least one upper filter deposited on the first substrate;
- (c) depositing at least one lower filter on an upper surface of a second substrate;
- (d) packaging the at least one lower filter deposited on the second substrate;
- and
- (e) joining a lower surface of the first substrate to a lower surface of the second substrate to face each other.
Dependencies are inferred from the claim text.