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US 2007/0182430 A1Published application
Probe head with machine mounting pads and method of forming same
AssigneeTouchdown Technologies, Inc.
InventorsSalleh Ismail, Raffi Garabedian, Steven Wang
Life of this patent
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Abstract
A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.
Claims15
A probe head for testing semiconductor wafers, comprising:
- a probe contactor substrate having a top side and a bottom side;
- a plurality of probe contactor tips coupled to the bottom side, the plurality of probe contactor tips lying substantially in a first plane;
- and
- a plurality of sub-mounting structures on the top side, each mounting structure having an upper surface planarized such that each upper surface lies substantially in a second plane, wherein the first plane is substantially parallel to the second plane, and each upper surface is adapted to be attached to another mounting structure.
1 more element
A probe card assembly, comprising:
- a wiring board;
- a probe contactor substrate having a top side and a bottom side;
- a plurality of probe contactor tips coupled to the bottom side, the plurality of probe contactor tips lying substantially in a first plane;
- and
- a plurality of sub-mounting structures on the top side, each mounting structure having an upper surface planarized such that each upper surface lies substantially in a second plane, wherein the first plane is substantially parallel to the second plane, and each upper surface is adapted to be coupled to wiring board,
2 more elements
Dependencies are inferred from the claim text.