Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit

An acoustic resonator, comprising:

• at least two active elements;
• and
• a decoupling assembly placed between pairs of active elements comprising at least a layer of low-acoustic-impedance material made of a low-electrical-permittivity material;
• wherein the low-acoustic-impedance material comprises a porous SiOC material.

An integrated circuit, comprising:

• a substrate;
• a set of interconnects;
• and
• an acoustic resonator that is provided with at least two active elements and with a decoupling layer positioned between each pair of active elements.

A decoupling structure, comprising:

• at least one assembly positioned between a first and second acoustic resonators, comprising:
• a first layer of low-acoustic-impedance material having a first acoustic impedance;
• and
• a second layer of low-acoustic-impedance material having a second acoustic impedance.

A decoupling structure, comprising:

• at least one assembly positioned between a first and second acoustic resonators, comprising:
• a first layer of low-acoustic-impedance material having a first acoustic impedance;
• a second layer of low-acoustic-impedance material having a second acoustic impedance;
• a layer of high-acoustic-impedance material.

An acoustic resonator, comprising

• a first, second and third active elements;
• a support positioned under the first active element comprising a first high acoustic impedance layer and a first low acoustic impedance layer;
• a first decoupling assembly positioned between the first and second active elements comprising plural layers of acoustic-impedance material;
• and
• a second decoupling assembly positioned between the second and third active elements comprising plural layers of acoustic-impedance material.