Semiconductor component and method for producing semiconductor components

A semiconductor component having a semiconductor chip, comprising:

• a semiconductor substrate having an active top side, an active area region on the active top side and contact areas which surround the active area region and are electrically connected to the active area region;
• a covering protecting the active area region, the covering forming a cavity above the active area region;
• a circuit carrier;
• contacts projecting between the contact pads and the circuit carrier;
• and
• where an interspace between the circuit carrier and semiconductor chip is filled with an electrically insulating underfiller material having edge sides, and the edge sides of the underfiller material and the semiconductor chip being encapsulated by a plastic housing composition.

A semiconductor wafer comprising:

• semiconductor chip positions arranged in rows and columns with active area regions on an active top side of the semiconductor wafer;
• contact areas surrounding the active area region of a semiconductor chip position and being electrically connected to the active area region via wiring lines;
• and
• a self-supporting covering configured to protect the active area region, and which forms a cavity above the active area region.

A method for producing a semiconductor wafer having a plurality of semiconductor chip positions, the method comprising:

• producing a semiconductor wafer having a plurality of semiconductor chip positions arranged in rows and columns;
• producing an active area region in the semiconductor chip positions on the active top side of the semiconductor wafer and applying of contact areas outside the active area region;
• producing a cavity housing structure above the active area region by photolithography from a photoresist;
• applying flip-chip contacts to the contact areas;
• and
• separating the semiconductor wafer into individual semiconductor chips.

A method for producing a panel having a plurality of semiconductor component positions, the method comprising:

• producing a semiconductor wafer having a plurality of semiconductor chip positions arranged in rows and columns;
• producing an active area region in the semiconductor chip positions on the active top side of the semiconductor wafer and application of contact areas outside the active area region;
• producing a cavity housing structure above the active area region by photolithography from a cured and crosslinked photoresist;
• applying flip-chip contacts to the contact areas;
• separating the semiconductor wafer into individual semiconductor chips;
• producing a circuit carrier having semiconductor component positions arranged in rows and/or columns, the semiconductor component positions comprising contact pads for electrical connection to flip-chip contacts of a semiconductor chip;
• applying the semiconductor chips by their flip-chip contacts on the contact pads of the circuit carrier in the semiconductor component positions;
• and
• pressure-free underfilling of the interspace between semiconductor chips and circuit carrier with a curable synthetic resin with formation of edge sides made from underfiller material.

A method for producing a plurality of semiconductor components, the method comprising:

• producing a semiconductor wafer having a plurality of semiconductor chip positions arranged in rows and columns;
• producing an active area region in the semiconductor chip positions on the active top side of the semiconductor wafer and application of contact areas outside the active area region;
• producing a cavity housing structure above the active area region by photolithography from a cured and crosslinked photoresist;
• applying flip-chip contacts to the contact areas;
• separating the semiconductor wafer into individual semiconductor chips;
• producing a circuit carrier having semiconductor component positions arranged in rows and/or columns and having contact pads for electrical connection to flip-chip contacts of a semiconductor chip;
• applying the semiconductor chips by their flip-chip contacts on the contact pads of the circuit carrier in the semiconductor component positions;
• pressure-free underfilling of the interspace between semiconductor chips and circuit carrier with a curable synthetic resin with formation of edge sides made from underfiller material;
• encapsulating at least the free top side of the circuit carrier, the edge sides of the underfiller material and the semiconductor chips with a plastic housing composition under compression pressure and with formation of a composite board as panel;
• separating the panel into individual semiconductor components.