Electronic component package
AssigneePanasonic Corporation
InventorAtsushi Takano
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Abstract
The electronic component package includes a mounting board, an electronic component and a molding resin. An external electrode is disposed on a surface of the mounting board. The electronic component connected to the mounting board via the external electrode includes a component-substrate, a device, a component-cover and a resin-made protector. The component-substrate composed of piezoelectric body includes the first surface on which the device is disposed and the second surface opposing the first surface. The component-cover covers the first surface of the substrate and the device. The protector provided on the second surface contains filler. The molding resin covers the electronic component on the mounting board.
Claims1
An electronic component package comprising:
- a mounting board;
- an external electrode being disposed on a surface of the mounting board;
- an electronic component connected to the mounting board via the external electrode, the electronic component having;
- a component-substrate composed of piezoelectric body having a first surface and a second surface opposing the first surface,
- a device disposed on the first surface,
- a component-cover covering the substrate on the first surface and the device, and
- a protector composed of a resin including filler and provided on the second surface,
- and
- a molding resin covering the electronic component on the mounting board.
Dependencies are inferred from the claim text.