Semiconductor device
AssigneeKabushiki Kaisha Shinkawa
InventorShinichi Nishiura
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Abstract
A semiconductor device having a plurality of pads P11, P12, P21, P22, P31, and P32 on the same plane of a semiconductor chip with wires W1, W2, and W3 connected between the pads P11 and P12, P21 and P22, and P31 and P32, respectively, so as to be electrically isolated from each other or without contacting each other. For the crossing and electrically isolated wires W1 and W2 respectively having pads P11 and P22 that are adjacently located very close, the wires are connected so that one pad P11 is set to be a first bonding point where a rising portion 12 of one wire W1 is bonded, and the other pad P22 is set to be a second bonding point to which a downwardly inclined end of the other wire W2 opposite from its cubic interchanging crossing and electrically isolated is bonded.
Claims8
A semiconductor device comprising:
- a plurality of pads provided on a same plane of a semiconductor chip, said pads being comprised of pairs thereof;
- and
- a plurality of wires each bonded from one pad to another pad with at least one of said wires crossing at least other one of said wires and electrically isolated therefrom.
Dependencies are inferred from the claim text.